Considerations for Thermal and Reliability Performance of Cooling Solutions Utilizing Phase-Change Materials Video

Future Product and Platform Resiliency Panel Discussion Video

Future Product and Platform Resiliency Panel Discussion Slides

Interconnect Reliability in Advanced Packaging and Heterogeneous Integration

Electronics Packaging Society Newsletter Summer 2023

Hybrid Bonding: Greater Functionality, Higher Performance and Smaller Size

Advanced Packaging for Wide Bandgap Semiconductor Power Modules

Submicron Nanosecond Thermoreflectance Imaging for Thermal and Failure Analysis

Electronics Packaging Society Newsletter Winter 2023