Chemical Mechanical Polishing (CMP) for Hybrid Bonding

(43:42 +Q&A) Sameer Deshpande, Applied Materials -- overview, planarization, forces, dishing, surface roughness, temp control, strategies ... Summary: This talk provides a comprehensive overview of Chemical Mechanical Polishing (CMP) for Hybrid Bonding in semiconductor manufacturing. CMP is defined as a technique that combines chemical and mechanical forces to planarize films. The role of CMP in hybrid bonding (HB) is explored, emphasizing its significance in achieving controlled dishing and surface roughness. Key challenges in CMP for HB, such as scratches, dishing, and loading are addressed along with strategies for managing them. The talk concludes by emphasizing the importance of co-optimization of CMP for HB and its implications in semiconductor manufacturing and advanced packaging. Dr. Sameer Deshpande is Director of Product Marketing at Applied Materials’ CMP Business Unit. He received his PhD in Materials Science and Engineering in 2007 from the University of Central Florida (UCF) and has published over 20 papers and filed numerous patents. Currently, Dr. Deshpande focuses on developing products for Chemical Mechanical Planarization (CMP), aimed at 3D integration and wafer level packaging. To access videos of other talks, and to hear about upcoming chapter events, please subscribe to our ListServ Dlist: https://ieee.org/scveps.