Skip to main content
Sort by
Using Diamond in Advanced Packaging: Current Developments and Status
14 Mar 2024

Using Diamond in Advanced Packaging: Current Developments and Status

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: Free
    Non-members: Free
Electronics Packaging Society Newsletter Summer 2024
01 Jul 2024

Electronics Packaging Society Newsletter Summer 2024

  • EPS
    Members: Free
    IEEE Members: Free
    Non-members: Free
Metallization of Glass Core and Through-Glass Vias
18 Apr 2024

Metallization of Glass Core and Through-Glass Vias

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00
Nanostructured Thermal Interface for Advanced Thermal Management
01 Mar 2024

Nanostructured Thermal Interface for Advanced Thermal Management

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00
Additive Manufacturing: Packaging Applications and Growth Needs for Heterogeneous Integration Impact
01 Feb 2024

Additive Manufacturing: Packaging Applications and Growth Needs for Heterogeneous Integration Impact

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: Free
    Non-members: Free
Nanopackaging for FutureG and THz System Solutions
10 Jan 2024

Nanopackaging for FutureG and THz System Solutions

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00
Electronics Packaging Society Newsletter Summer 2024
01 Jan 2024

Electronics Packaging Society Newsletter Summer 2024

  • EPS
    Members: Free
    IEEE Members: Free
    Non-members: Free
Nanopackaging for AI , Power and THz Solutions
13 Dec 2023

Nanopackaging for AI , Power and THz Solutions

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00
Reliability and Lifetime Estimation of Power Electronic Modules
12 Dec 2023

Reliability and Lifetime Estimation of Power Electronic Modules

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00