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Advanced Packaging for Silicon Photonics Based Modules and Applications
25 Jun 2019

Advanced Packaging for Silicon Photonics Based Modules and Applications

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: Free
    Non-members: Free
Making and Qualifying Reliable Extreme Environment Electronics
16 Apr 2019

Making and Qualifying Reliable Extreme Environment Electronics

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00
Can Moore''s Law for Packaging Replace Moore''s Law for ICS
26 Feb 2019

Can Moore''s Law for Packaging Replace Moore''s Law for ICS

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00
TSV and FOWLP Reliability Challenge Overview
29 Nov 2018

TSV and FOWLP Reliability Challenge Overview

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00
Achieving High Reliability for Lead Free Solder Joints - Materials Consideration
20 Nov 2018

Achieving High Reliability for Lead Free Solder Joints - Materials Consideration

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00
Flip Chip Interconnection and Its Applications
10 Aug 2018

Flip Chip Interconnection and Its Applications

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00
Electronics Packaging Society Newsletter Summer 2018
01 Jul 2018

Electronics Packaging Society Newsletter Summer 2018

  • EPS
    Members: Free
    IEEE Members: Free
    Non-members: Free
Energy Harvesting Introduction and Challenges
04 May 2018

Energy Harvesting Introduction and Challenges

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00
Moore''s Law for Packaging aka "Moore''s Law for Heterogeneous Integration"
27 Mar 2018

Moore''s Law for Packaging aka "Moore''s Law for Heterogeneous Integration"

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00
Multi Die Heterogeneous Integration: Design Considerations and Technology Demonstrations
13 Jan 2018

Multi Die Heterogeneous Integration: Design Considerations and Technology Demonstrations

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00
Electronics Packaging Society Newsletter Winter 2018
01 Jan 2018

Electronics Packaging Society Newsletter Winter 2018

  • EPS
    Members: Free
    IEEE Members: Free
    Non-members: Free
The Origins of Silicon Valley: Early Technology and EPS
04 Dec 2017

The Origins of Silicon Valley: Early Technology and EPS

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: $11.00
    Non-members: $15.00