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Advanced X-ray Imaging Technologies for Heterogeneous 3D IC Package Metrology and Inspection
18 Jul 2024

Advanced X-ray Imaging Technologies for Heterogeneous 3D IC Package Metrology and Inspection

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: Free
    Non-members: Free
Thermal Challenges and Advanced Cooling Opportunities for 2.5D and 3D High Performance Computing
19 Mar 2024

Thermal Challenges and Advanced Cooling Opportunities for 2.5D and 3D High Performance Computing

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: Free
    Non-members: Free
A 3D Heterogenous Integration Future: Enabling Continued Scaling of Electronics Systems
11 Jul 2022

A 3D Heterogenous Integration Future: Enabling Continued Scaling of Electronics Systems

1.00 pdh
  • EPS
    Members: Free
    IEEE Members: Free
    Non-members: Free
Heterogeneous Integration Roadmap (HIR) Chapter 22 Interconnects for 2D and 3D Architectures
13 May 2020

Heterogeneous Integration Roadmap (HIR) Chapter 22 Interconnects for 2D and 3D Architectures

  • EPS
    Members: Free
    IEEE Members: Free
    Non-members: Free