Chiplet-In-Wafer Technology For The Development Of III-V RF IC

Abstract: New requirements for communication (e.g., 5G) and radar (e.g., automotive) applications at millimeter-wave frequencies have fostered the development of new packaging solutions for circuit and subsystem manufacturing. In the area of RF compound semiconductors, technologies for the co-integration of high-performance devices and silicon circuits have also emerged. HRL is developing a technology called MECAMIC (Metal Embedded Chiplet Assembly for Microwave Integrated Circuits) that uses GaN transistor chiplets integrated in the volume of passive interposer wafers. Engineering advances in chiplet manufacturing and assembly will be presented, along with a Process Design Kit and circuit demonstrators up to W-band. Bio: Florian Herrault received his B.S. and M.S. degrees in physics and materials science from the National Institute of Applied Sciences (INSA), Toulouse, France, in 2003 and 2005, respectively. He received his Ph.D. degree in electrical and electronics engineering from the University of Toulouse, Toulouse, in 2009 while doing his research at the Georgia Institute of Technology. From 2009 to 2013, he was a Research Engineer and the Deputy Director with the MicroSensors and MicroActuators Group, Georgia Tech. Since 2013, he has been with HRL Laboratories, LLC, Malibu, CA, where he is the leader of the Advanced Packaging Solutions Group in the RF, E/O, and IR subsystems Department. He also holds the position of strategy lead for RF GaN. He is an active IEEE member, currently serving on the Executive Committee of the IEEE ECTC conference, and as a committee member of the IEEE IMS conference.