Co-Design for Unlocking the 3D IC Potential: A Micro-Fluidic Cooling Perspective Ankur Srivastava DOI 10.17023/enf0-cn78 EPS Members: Free IEEE Members: $11.00 Non-members: $15.00 Length: 01:17:10 24 Sep 2014 Tags: ankur srivastava video co design 3d ic potential eps micro fluidic unlocking cooling perspective IEEE
24 Sep 2014 Tags: ankur srivastava video co design 3d ic potential eps micro fluidic unlocking cooling perspective IEEE